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MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
DESCRIPTION
The M32000D4BFP-80 is a new generation microcomputer with a 32-bit CPU and built-in high capacity DRAM. Using this device it is possible to implement the complex applications of the multimedia age with high performance and low power consumption. The M32000D4BFP-80 contains 2M bytes of DRAM and 4K bytes of cache memory. The CPU is implemented with a RISC architecture and has a high performance figure of 62.9 MIPS (at an internal clock rate of 80 MHz). Memory for main storage is provided internally to the device eliminating external memory and associated control circuits thus reducing overall system noise and power consumption. The CPU, internal DRAM and cache memory are connected by a 128-bit, 12.5 ns/cycle (at internal 80MHz) internal bus which virtually eliminates transfer bottlenecks in between the CPU and the memory. The M32000D4BFP-80 internally multiplies the frequency of the input clock signals by four. For an internal operating frequency of 80 MHz the input clock frequency is 20 MHz. A 16-bit data and 24-bit address bus are the M32000D4BFP-80's external bus and the interface to external peripheral controllers. When the hold state is set, the internal DRAM can be accessed from an external device. A 3-chip basic system configuration using the M32000D4BFP-80 is the device itself plus an ASIC as a peripheral controller and a program ROM. Execution starts from the reset vector entry on the external ROM after power on, a program requiring high speed execution is then transferred to internal DRAM and this is then executed. The M32000D4BFP-80 also has a slave mode additional to its master mode. When set to slave mode the M32000D4BFP-80 can be used as a coprocessor. In this mode it does not access its external bus immediatly after reset, but waits for the master to start its operation.
FEATURES
* CPU .......................................................... M32R family CPU core * Pipeline .............................................................................. 5 steps * Basic bus cycle ................................. 12.5 ns (at internal 80 MHz) * Logical address space ............................................ 4G-byte linear * External bus ........................................................ data bus: 16 bits
address bus: 24 bits
* Internal DRAM ................................................ 16M bits (2M bytes) * Cache .......................................................... 4K bytes (direct map) * Register configuration ...... general-purpose registers: 32 bits x 16
control registers: 32 bits x 5
* Instruction set ........................ 83 instructions/6 addressing modes * Instruction format .................................................... 16 bits/32 bits * Multiply-accumulate operation unit (DSP function instruction) * Internal memory controller * Programmable I/O ports * Power management function .................................. standby mode * * * *
/CPU sleep mode PLL clock generating circuit ................. four-time clock PLL circuit Operation mode .............................................. master/slave mode ___ ___ Interrupt input ............................................................ INT and SBI Power source .......................................................... 3.3 V (10 %)
APPLICATIONS
Portable equipment, Still camera, Navigation system, Digital instrument, Printer, Scanner, FA equipment
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
PIN CONFIGURATION (TOP VIEW)
VCC
VCC
VCC
BCH
VCC
71
79
64
56
72
80
65
73
58
57
66
74
59
67
75
60
68
76
61
69
77
62
70
VSS D15 D14 D13 D12 VCC
BURST
81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100
78
63
55
54
53
52
51
50 49 48 47 46 45 44 43
VCC
VSS
VSS
VSS
A27
RST
BCL
R/W
A25
VSS
A22
A28
A26
A23
*1
A21
SID
A20
A30
A29
M/S
A24
*1
*1
*1
VSS D7 D6 D5 D4 VCC VCC VSS VSS VCC HREQ HACK SBI INT *1 D3 D2 D1 D0 VSS
ST VCC VSS VCC VSS VCC WKUP VCC D11 D10 D9 D8 VSS
M32000D4BFP-80 100-pin QFP/0.65 mm pitch
42 41 40 39 38 37 36 35 34 33 32 31
10
17
25
16
23
24
15
22
14
21
13
20
12
19
11
PLLCAP
A16
A14
BS
18
A13
*2
26
A10
27
28
VCC
A17
VSS
A15
STBY
VCC
PLLVCC
CLKIN
VSS
A18
A19
PP0
A11
A9
A8
*1
29
PLLVSS
Note: Connect *1 pins to VCC. Connect *2 pins to VSS.
2
VCC
VSS
CS
PP1
A12
DC
30
2
3
4
5
1
6
7
8
9
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
BLOCK DIAGRAM
128 cache memory (4K bytes)
128
instruction queue (128 bits x 2 stages)
M32000D4BFP-80
32 bits M32R CPU core instruction decoder M/S
128-bit internal bus
RST
register PC 32 bits x 16 ALU shift load/ store
multiplyaccumulate unit 32 x 16 bits MUL + 56-bit ACC INT SBI WKUP STBY
128 DRAM (2M bytes)
32 bits 128 data selector 32 bits128 bits memory controller
programmable I/O port
PP0 PP1 CLKIN PLLCAP PLLVCC PLLVSS
128 external bus interface unit 128 bits16 bits
PLL clock generating circuit
23 16
BCL ST BURST DC D0 - D15 HREQ HACK A8 - A30 BCH R/W SID CS BS
3
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
FUNCTIONS
function block CPU core characteristics * bus specification basic bus cycle: 12.5 ns (internal operation at 80 MHz) logical address space: linear 4G bytes ____ ____ external address bus: 24 bits (external output pin: A8 to A30, BCH, BCL) external data bus: 16 bits * implementation: 5-stage pipeline * core internal: 32 bits * register configuration general-purpose registers: 32 bits ! 16 control registers: 32 bits ! 5 * instruction set 16-bit/32-bit instruction format 83 instructions/6 addressing modes * multiply-accumulate operation built in * 16M bits (2M bytes) * * * * 4K bytes (internal instruction/data cache mode, instruction cache mode, cache-off mode) cache control internal DRAM control, refresh control power management function (standby mode, CPU sleep mode selection control)
internal DRAM cache memory memory controller
programmable I/O port
* two programmable I/O ports
4
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
PIN FUNCTION DIAGRAM
CLKIN
SID BCL BCH BS ST R/W BURST DC HREQ HACK CS
clock
PLLCAP PLLVCC PLLVSS
RST
system control
M/S WKUP STBY
address bus
A8 - A30
23
M32000D4BFP-80
bus control
INT
data bus
D0 - D15
16
SBI
interrupt input
PP0 PP1
programmable I/O port
16
15
VCC VSS
5
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
PIN DESCRIPTION (1/3)
type power source clock pin name VCC VSS CLKIN name power source ground clock input I/O - - input function All power source pins should be connected to VCC. All ground pins should be connected to VSS. Clock input pin. The M32000D4BFP-80 has an internal PLL multiplier circuit, and an input clock which is 1/4 of the internal operating frequency (when the internal operating frequency is 80 MHz, the CLKIN input is 20 MHz). Connects a capacitor for the internal PLL. Power source for the internal PLL. Ground for the internal PLL. Internally resets the M32000D4BFP-80. It is also used to return from standby mode and CPU sleep mode. Sets the M32000D4BFP-80 default operation to either system _ _ bus master (M/S = "H") or bus slave (M/S = "L"). When the M32000D4BFP-80 is set to bus slave, it does not carry out a reset vector entry fetch after a reset. _ The setting of M/S cannot be changed during operation. Keep at either an "H" or an "L" level. Input pin to request return from standby mode. _____ This is only accepted when STBY is "L" level. It generates the wakeup interrupt. Indicates that the M32000D4BFP-80 has switched to standby mode. An "L" level is output while the device is in standby mode. The M32000D4BFP-80 has a 24-bit address (A8 to A31) bus for a 16 MB address space. A31 is not output. During the write cycle, the valid byte positions on the 16-bit data bus are output ____ ____ as BCH or BCL. During the read cycle, the 16-bit data bus is read, however,only data in the valid byte positions is transferred to the M32000D4BFP-80. Address bus pins are bidirectional. When accessing the internal DRAM from an external bus master while the M32000D4BFP-80 is in the hold state, input the address from the system bus side. 16-bit data bus for connecting to external devices.
PLLCAP PLLVCC PLLVSS
____
system control
RST
_
C connection for PLL power source for PLL ground for PLL reset master/slave
- - - input input
M/S
______
WKUP
_____
wakeup
input
STBY
standby
output
address bus
A8 to A30
address bus
I/O (Hi-Z)*
data bus
D0 to D15
data bus
I/O (Hi-Z)*
* (Hi-Z): This pin goes to high-impedance in the hold state.
6
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
PIN DESCRIPTION (2/3)
type bus control pin name SID name space identifier
____
I/O output (Hi-Z)*
function Space identifier between user space and I/O space. SID = "L": user space SID = "H": I/O space SID = undefined: when idle Indicates the valid byte positions of transferred data. ____ ____ BCH corresponds to the MSB side (D0 to D7), and BCL corresponds ____ to the LSB side (D8 to D15). During a read bus cycle, both BCH ____ and BCL are an "L" level. ____ ____ During a write bus cycle, either BCH and/or BCL is an "L" level depending on the byte(s) to be written. When accessing the internal DRAM from an external bus master, the byte control signal is input from the system bus side. __ When the M32000D4BFP-80 drives an external bus cycle, BS goes to an "L" level at the start of the bus cycle. __ In burst transfer, BS goes to the "L" level for each transfer cycle. When accessing internal__ resources such as an internal DRAM or internal I/O register, BS is not output. Indicates whether the bus cycle that the M32000D4BFP-80 drives is an instruction fetch access cycle or an operand access cycle. ST = "L": for instruction fetch access ST = "H": for operand access ST __ undefined: when idle = Outputs R/W to identify whether the external bus cycle a read or a write cycle. When accessing the internal DRAM from an external __ bus master, R/W is input from the external bus. The M32000D4BFP-80 drives two consecutive bus cycles to access 32-bit data allocated on the 32-bit word boundary. For instruction fetches, it drives 8 (max.) consecutive cycles (8 cycles in instruction cache mode) to data on the 128-bit boundary. ______ During these consecutive bus cycles, BURST goes to "L" level. When accessing 32-bit data, an "L" level followed by an "H" level is output from address A30, because the MSB-side 16 bits are accessed prior to the LSB-side 16 bits. When accessing 128-bit data, the addresses are output from an arbitrary 16-bit aligned address and wraparound within a 128-bit aligned boundary.
____
BCH, BCL
byte control
I/O (Hi-Z)*
__
BS
bus start
output (Hi-Z)*
ST
bus status
output (Hi-Z)*
__
R/W
______
read/write
I/O (Hi-Z)* output (Hi-Z)*
BURST
burst
* (Hi-Z): This pin goes to high-impedance in the hold state.
7
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
PIN DESCRIPTION (3/3)
type bus control (cont.) pin name
__
name data complete
I/O I/O (Hi-Z)
function When the M32000D4BFP-80 drives an external bus cycle, it __ automatically inserts wait cycles until DC is input by the slave device in the system bus. When the M32000D4BFP-80 is in the hold state and the internal DRAM is accessed from an external bus master,the __ M32000D4BFP-80 outputs DC to notify to the external bus master that the bus cycle to the internal DRAM has been completed. ______ Bus right request input pin of the system bus. When HREQ is an "L" level, the M32000D4BFP-80 switches to the hold state. Indicates that the M32000D4BFP-80 has switched to the hold state and releases the bus right of the system bus to the requestor. Signal input to the M32000D4BFP-80 when it is in the hold state to request access to the internal DRAM from an external bus __ master. When an "L"level is input to CS, the M32000D4 BFP-80 accesses the internal DRAM at the address input via the address pins. ___ System break interrupt input pin. The SBI is not masked by the IE bit in the PSW register. It is also used to return from CPU sleep mode and to request the start of operation in slave mode. External interrupt request input pin. It is also used to return from CPU sleep mode and to request the start of operation the slave mode. Two programmable I/O ports.
DC*
______
HREQ
_____
hold hold acknowledge chip select
input output input
HACK
__
CS
___
interrupt controller
SBI
___
INT
system break interrupt external interrupt port
input
input
programmable I/O port
PP0, PP1
I/O
* This __ goes to high-impedance in the hold state. pin __ The DC pin becomes an output pin when the CS signal is input to the M32000D4BFP-80.
8
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
FUNCTIONAL DESCRIPTION CPU
The M32R CPU has 16 general-purpose registers, 5 control registers, an accumulator and a program counter. The accumulator is of 64-bit width. The registers and program counter are of 32-bit width.
Control registers
There are 5 control registers which are the processor status word register (PSW), the condition bit register (CBR), the interrupt stack pointer (SPI), the user stack pointer (SPU) and the backup PC (BPC). The MVTC and MVFC instructions are used for writing and reading these control registers.
General-purpose registers
The 16 general-purpose registers (R0 - R15) are of 32-bit width and are used to retain data and base addresses. R14 is used as the link register and R15 as the stack pointer (SPI or SPU). The link register is used to store the return address when executing a subroutine call instruction. The interrupt stack pointer (SPI) and the user stack pointer (SPU) are alternatively represented by R15 depending on the value of the stack mode bit (SM) in the processor status word register (PSW).
(see notes)
CRn
0
31
CR0 CR1 CR2 CR3
PSW CBR SPI SPU
processor status word register condition bit register interrupt stack pointer user stack pointer
CR6
0 31 0 31
BPC
backup PC
R0 R1 R2 R3 R4 R5 R6 R7
R8 R9 R10 R11 R12 R13 R14 (link register) R15 (stack pointer) (see note)
Notes 1: CRn (n = 0 - 3, 6) denotes the control register number. 2: The MVTC and MVFC instructions are used for writing and reading these control registers.
Fig. 2 Control registers
Note: The interrupt stack pointer (SPI) and the user stack pointer (SPU) are alternatively represented by R15 depending on the value of the stack mode bit (SM) in the PSW.
Fig. 1 General-purpose registers
9
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
Processor status word register
The processor status word register (PSW) shows the M32R CPU status. It consists of the current PSW field, and the BPSW field where a copy of the PSW field is saved when EIT occurs.
The PSW field is made up of the stack mode bit (SM), the interrupt enable bit (IE) and the condition bit (C). The BPSW field is made up of the backup stack mode bit (BSM), the backup interrupt enable bit (BIE) and the backup condition bit (BC).
BPSW field
PSW field
0
7
8
15 16 17
23 24 25
31
PSW
0000000000000000
00000
00000
BSM
BIE
BC
SM
IE
C
D 16 17 23 24 25 31
bit name BSM (backup SM) BIE (backup IE) BC (backup C) SM (stack mode) IE (interrupt enable) C (condition bit)
function saves value of SM bit when EIT occurs saves value of IE bit when EIT occurs saves value of C bit when EIT occurs 0: uses R15 as the interrupt stack pointer 1: uses R15 as the user stack pointer 0: does not accept interrupt 1: accepts interrupt indicates carry, borrow and overflow resulting from operations (instruction dependent)
init. undefined undefined undefined 0 0 0
R
W
Note: "init." ...initial state immediately after reset "R" .... : read enabled "W" .... : write enabled
Fig. 3 Processor status word register
10
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
Condition bit register
The condition bit register (CBR) is a separate read-only register which contains a copy of the current value of the condition bit (C) in the PSW. An attempt to write to the CBR with the MVTC instruction is ignored.
Backup PC
The backup PC (BPC) is the register where a copy of the PC value is saved when EIT occurs. Bit 31 is fixed at "0". When EIT occurs, the PC value immediately before EIT occurrence or that of the next instruction is set. The value of the BPC is reloaded to the PC when the RTE instruction is executed. However, the values of the lower 2 bits of the PC become "00" on returning (It always returns to the word boundary).
Interrupt stack pointer, User stack pointer
The interrupt stack pointer (SPI) and the user stack pointer (SPU) retain the current stack address. The SPI and SPU can be accessed as the general-purpose register R15. R15 switches between representing the SPI and SPU depending on the value of the stack mode bit (SM) in the PSW.
0
31
CBR
0000000000000000000000000000000C
0 31
SPI
0
SPI
31
SPU
0
SPU
31
BPC
BPC
0
Fig. 4 Condition bit register, interrupt stack pointer, user stack pointer and backup PC
11
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
Accumulator
The accumulator (ACC) is a 64-bit register used for DSP type functions. Use the MVTACHI and MVTACLO instructions for writing to the accumulator. The high-order 32 bits (bit 0 - bit 31) can be set with the MVTACHI instruction and the low-order 32 bits (bit 32 - bit 63) can be set with the MVTACLO instruction. Use the MVFACHI, MVFACLO and MVFACMI instructions for reading from the accumulator. The high-order 32 bits (bit 0 - bit 31) are read with the MVFACHI instruction, the low order 32 bits (bit 32 - bit 63) with the MVFACLO instruction and the middle 32 bits (bit 16 - bit 47) with the MVFACMI instruction.
Program counter
The program counter (PC) is a 32-bit counter that retains the address of the instruction being executed. Since the M32R CPU instruction starts with even-numbered addresses, the LSB (bit 31) is always "0".
(see note)
0 78 15 16
read range with MVFACMI instruction
31 32 47 48 63
ACC
read/write range with MVTACHI or MVFACHI instruction read/write range with MVTACLO or MVFACLO instruction
Note: Bits 0 - 7 are always read as the sign-extended value of bit 8. An attempt to write to this area is ignored.
Fig. 5 Accumulator
0
31
PC
PC
0
Fig. 6 Program counter
12
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
Data types
Signed and unsigned integers of byte (8 bits), halfword (16 bits), and word (32 bits) types are supported as data in the M32R CPU instruction set. A signed integer is represented in a 2's complement format.
Data formats
Data size of a register of the M32R CPU is always a word (32 bits). Byte (8 bits) and halfword (16 bits) data in memory are sign-extended (the LDB and LDH instructions) or zero-extended (the LDUB and LDUH instructions) to 32 bits, and loaded into the register. Word (32 bits) data in a register is stored to memory by the ST instruction. Halfword (16 bits) data in the LSB side of a register is stored to memory by the STH instruction. Byte (8 bits) data in the LSB side of a register is stored to memory by the STB instruction. Data stored in memory can be one of these types: byte (8 bits), halfword (16 bits) or word (32 bits). Although the byte data can be located at any address, the halfword data and the word data can only be located on the halfword boundary and the word boundary, respectively. If an attempt is made to access data in memory which is not located on the correct boundary, an address exception occurs.
0
7
signed byte (8-bit) integer
S
0 7
unsigned byte (8-bit) integer
0 15
signed halfword (16-bit) integer
S
0 15
unsigned halfword (16-bit) integer
0 31
signed word (32-bit) integer
S
0 31
unsigned word (32-bit) integer
S: sign bit
Fig. 7 Data type

from memory (LDB, LDUB instruction)
24 31

address +0
0 78
< load >
0
sign-extention (LDB instruction) or zero-extention (LDUB instruction)
+1
15 16
+2
23 24
+3
31
Rn
sign-extention (LDH instruction) or zero-extention (LDUH instruction)
0 16
byte from memory (LDH, LDUH instruction)
31
byte byte byte byte byte
Rn
halfword from memory (LD instruction)
0 31
Rn
word
halfword halfword halfword
< store >
0 24 31
word
word
Rn
byte
to memory (STB instruction)
0 16 31
Rn
halfword
to memory (STH instruction)
0 31
Rn
word
to memory (ST instruction)
Fig. 8 Data format
13
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
Address space
The M32000D4BFP-80 logical address is 32-bit wide and offers 4 GB linear space. The M32000D4BFP-80 has address spaces allocated as shown below. The user space is specified by SID = 0 (H'0000 0000 to H'7FFF FFFF). The area available to the user is 16 MB from address H'0000 0000 to address H'00FF FFFF. The I/O space is specified by SID = 1 (H'8000 0000 to H'FFFF FFFF). The area available to the user is 16 MB from address H'FF00 0000 to address H'FFFF FFFF. The I/O space cannot be cached.
These areas below are allocated in each space. * User space internal DRAM area external area * I/O space user I/O area system area internal I/O area
< logical space >
< physical space >
EIT vector entry (except for reset interrupt)
logical address
SID logical address
physical address (24 bits)
H'0000 0000
(16M bytes)
H'0000 0000
internal DRAM area (2M bytes)
0 : H'00 0000 0 : H'1F FFFF 0 : H'20 0000
H'001F FFFF H'0020 0000
user space (SID = 0)
external area (14M bytes)
H'00FF FFFF
0 : H'FF FFFF
H'7FFF FFFF H'8000 0000
EIT vector entry (reset interrupt) physical address (24 bits)
SID logical address
H'FF00 0000
user I/O area (8M bytes) I/O space (SID = 1)
1 : H'00 0000
H'FF7F FFFF H'FF80 0000 H'FFBF FFFF H'FFC0 0000
(16M bytes)
system area (4M bytes)
1 : H'7F FFFF 1 : H'80 0000 1 : H'BF FFFF 1 : H'C0 0000
internal I/O area (4M bytes)
H'FFFF FFFF
H'FFFF FFFF
1 : H'FF FFFF
Fig. 9 Address space
14
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
The internal DRAM (2 MB) is allocated from address H'0000 0000 to address H'001F FFFF. The EIT vector entry (other than the reset interrupt) is allocated in the address H'0000 0000 to address H'0000 008F of this area. The internal DRAM is connected to the M32R CPU via a 4 KB cache memory with a 128-bit bus. When the M32000D4BFP-80 is in the hold state, the internal DRAM can be accessed from an external bus master by inputting control signals. The external area consists of 14 MB from address H'0020 0000 to address H'00FF FFFF. When this space is accessed, the control signals to access external devices are output. The bottom 16 bytes in this area (H'00FF FFF0 to H'00FF FFFF) are the reset interrupt EIT vector entry.
The user I/O area is 8 MB from address H'FF00 0000 to address H'FF7F FFFF. When this space is accessed, the control signals to access external devices are output. The system area is 4 MB from address H'FF80 0000 to address H'FFBF FFFF. This area is reserved for development tools such as in-circuit emulators or debug monitors. The user cannot use this area. The internal I/O area is 4 MB from address H'FFC0 0000 to address H'FFFF FFFF. The memory controller and programmable I/O port registers are allocated in this area.
logical address
+0 address
+1 address
+2 address
+3 address
0
31
(reserved)
H'FFC0 0000
H'FFFF FFE0 H'FFFF FFE4 H'FFFF FFE8 H'FFFF FFEC
(reserved)
PPCR0 PPCR1 programmable I/O port PPDR0 PPDR1
H'FFFF FFF4 H'FFFF FFF8 H'FFFF FFFC
PPCR0: programmable I/O port direction control register 0 PPCR1: programmable I/O port direction control register 1 PPDR0: programmable port data register 0 PPDR1: programmable port data register 1
MLCR MPMR MCCR memory controller
MLCR: lock control register MPMR: power management control register MCCR: cache control register
Fig. 10 Internal I/O space memory map
15
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
EIT
While the CPU is executing a program, sometimes it is necessary to suspend execution, because a certain event occurs, and execute another program. These kinds of events are referred to as EIT (Exception, Interrupt, Trap). * Exception The event is related to the context being executed. It is generated by errors or violations that occur during instruction execution. With the M32000D4BFP-80, the address exception (AE) and reserved instruction exception (RIE) are of this type. * Interrupt The event is not related to the context being executed. It is generated by an external hardware signal. With the M32000D4BFP-80, the external interrupt (EI), system break interrupt (SBI), wakeup interrupt (WI) and reset interrupt (RI) are of this type. * Trap This is a software interrupt which is generated by executing the TRAP instruction. It is intentionally added to the program by the programmer, as a system call.
EIT
Exception
Reserved Instruction Exception (RIE) Address Exception (AE)
Interrupt
Reset Interrupt (RI) Wakeup Interrupt (WI) System Break Interrupt (SBI) External Interrupt (EI)
EIT events are shown below. * Reserved instruction exception (RIE) The reserved instruction exception (RIE) occurs when execution of a reserved instruction (unimplemented instruction) is detected. * Address exception (AE) The address exception (AE) occurs if an attempt is made to access an unaligned address with either a load instruction or a store instruction. * Reset interrupt (RI) ___ The reset interrupt (RI) is always accepted when the RST signal is input. It has the highest priority. * Wakeup interrupt (WI) ______ The wakeup interrupt (WI) is accepted when the WKUP signal is input while the M32000D4BFP-80 is in standby mode. It is only used to return from standby mode. * System break interrupt (SBI) ___ The system break interrupt (SBI) is an interrupt request from the SBI pin. It is used when a break in power source or an error from an external watchdog timer is detected. It is also used to return from CPU sleep mode and to start an M32000D4BFP-80 set to slave mode. * External interrupt (EI) ___ The external interrupt (EI) is an interrupt request from the INT pin. It is used by an interrupt from the external peripheral I/O and can be masked by the IE bit in the PSW register. It is also used to return from CPU sleep mode and to start an M32000D4BFP-80 set to slave mode. * Trap The trap (TRAP) is a software interrupt which is generated by executing the TRAP instruction. A total of 16 EIT vector entries are available for operands 0 to 15 of the TRAP instruction.
Trap
Trap (TRAP)
Fig. 11 EIT events
16
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
Internal memory system
The memory system built into the M32000D4BFP-80 has the following characteristics. * internal 16M-bit (2M-byte) DRAM * internal 4K-byte cache memory * CPU, cache and internal DRAM are connected by a 128-bit bus * selectable cache memory operation mode - internal instruction/data cache mode - instruction cache mode - cache-off mode
cache control register (MCCR) < address: H'FFFF FFFF>
D24 CP D25 D26 D27 D28 D29 D30 CM0 D31 CM1
When the internal instruction/data cache mode is selected, the cache memory functions as a cache for both instruction and data from the internal DRAM, and caches all bus access to the DRAM. This mode is for a system which uses the internal DRAM as main memory. Transfer between the M32R CPU, cache memory and internal DRAM is always carried out in blocks of 128 bits. Caching is carried out by the direct map method. Writing is by the copy back method. When the M32000D4BFP-80 access destination is an external space, data transfer between the M32R CPU and the external device is carried out via the bus interface unit (BIU). The BIU has a 128-bit data buffer which converts the bus width between the 128-bit bus in the M32000D4BFP-80 and the external bus. Caching is not applicable in this case of data transfer. When accessing the internal DRAM from an external bus master, and a cache hit occurs (the accessed data is inside the cache), data transfer between the cache memory and the external bus via the BIU is carried out. When a cache miss occurs, (the accessed data is not inside the cache) data transfer is carried out between the internal DRAM and the external bus via the BIU without cache replacement.
D 24 25 - 29 30, 31
bit name CP (cache purge) Not assigned. CM0, CM1 (cache mode)
function 0: no purge 1: purge
RW 0 0 !
M32000D4BFP-80
00: cache mode is not changed 01: cache-off mode 10: internal instruction/data cache mode 11: instruction cache mode R = ... read enabled W = ! : write disabled
CPU
DRAM
128 instruction/ data cache 128 128 BIU external bus interface 16 external bus (16 bits)
R = 0 ... "0" when reading W = ... write enabled Fig. 12 Cache control register
Fig. 13 Internal instruction/data cache mode
17
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
When the instruction cache mode is selected, the cache functions as an instruction cache for the internal DRAM or the external memory, and caching is carried out for instruction fetch access. This mode is designed for use when an external ROM is used as program memory and the internal DRAM is used as data memory, or when instructions are located in the internal DRAM. Caching is carried out by the direct map method. When instruction codes in the user space are overwritten by the external bus master or another source, instruction code coherency in the cache memory is not guaranteed. Furthermore, caching is not applied when accessing the internal DRAM from the external bus master.
When the cache-off mode is selected, the M32000D4BFP-80 internal memory system is configured as follows. In this mode, caching is not applied, and all bus cycles are directly to the internal DRAM or external bus.
M32000D4BFP-80
DRAM
external bus interface
M32000D4BFP-80
128 CPU
DRAM
128 BIU
16
external bus (16 bits)
external bus interface 128 CPU instruction cache 128 BIU 16 external bus (16 bits)
Fig. 15 Cache-off mode
Fig. 14 Instruction cache mode
18
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
Bus interface unit (BIU)
The M32000D4BFP-80 has the following signals related to the external bus. * Address (A8 to A30) The M32000D4BFP-80 has a 24-bit address bus (A8 to A31) corresponding to a 16 MB address space. Of these, A31 (the LSB) is not output externally. In write cycles, the validity of the two___ output bytes ___ on the 16-bit data bus is indicated by BCH and/or BCL. In read cycles, the 16-bit data bus is always read, however, only data in the valid byte position in the M32000D4BFP-80 is transferred. The address pins are bidirectional. If the M32000D4BFP-80 is in the hold state and the internal DRAM is accessed from an external bus master, the address signal is input from the system bus side. * Space identifier (SID) The space identifier is used to specify user space and I/O space. user space: SID = "L" I/O space: SID = "H" hold: SID = high-impedance idle: SID = undefined ___ ___ * Byte control (BCH, BCL) Byte control signals indicate the___ position of valid data transbyte ferred of the external bus cycle. BCH corresponds to the MSB side ________ (D0 to D7), and BCL corresponds to the LSB side (D8 to D15). Dur___ ___ ing the read bus cycle, both BCH and BCL are an "L" level. During ___ ___ the write bus cycle, BCH and/or BCL go to an "L" level depending on the bytes to be written. If the M32000D4BFP-80 is in the hold state and the internal DRAM is accessed from an external bus master, the byte control signal is input from the system bus side. * Data bus (D0 to D15) The M32000D4BFP-80 has a 16-bit data bus to access external devices. If the M32000D4BFP-80 is in the hold state and the internal DRAM is accessed from an external bus master, the data bus is used as a data I/O bus from the system bus side. __ * Bus start (BS) When the M32000D4BFP-80 drives the bus cycle to the system bus, __ an "L" level is output to BS at the start of the bus cycle. Also, for a __ __ burst transfer, the BS signal is output for each transfer cycle. The BS signal is not output when accessing internal resources such as the internal DRAM or internal I/O registers.
* Bus status (ST) The ST signal identifies whether the bus cycle the M32000D4BFP80 is driving is an instruction fetch cycle or an operand access cycle. instruction fetch access: ST = "L" operand access: ST = "H" hold: ST = high-impedance idle: ST__ undefined = * Read/write (R/W) __ The M32000D4BFP-80 outputs a R/W signal to identify whether the external bus cycle is a read or write operation. When accessing the __ internal DRAM from an external bus master, a R/W signal is input from the system bus side. __ read bus cycle: R/W = "H" __ write bus cycle: R/W = "L" ______ * Burst (BURST) The M32000D4BFP-80 drives two consecutive bus cycles to access 32-bit data located on the 32-bit boundary. In instruction fetching, it drives a maximum of 8 (fixed to 8 cycles in instruction cache mode) consecutive read cycles to access data located on the 128-bit boundary. While driving these consecutive bus cycles, the M32000D4BFP______ 80 outputs "L" level to BURST. When accessing 32-bit data, the address of the MSB-side 16 bits are output before the address of the LSB side 16 bits. When accessing 128-bit data, the addresses are output for every access cycle from the arbitrary 16-bit aligned addresses to wraparound within the 128-bit boundary. __ * Data complete (DC) When starting an external bus cycle, the M32000D4BFP-80 auto__ matically inserts wait cycles until the DC signal is input from external. __ Wait control using the DC signal is effective also for bus cycles during burst transfer. When the M32000D4BFP-80 is in the hold state __ __ and if the CS signal is input, the M32000D4BFP-80 outputs the DC signal to notify the external bus master that internal DRAM access is complete. _____ _____ * Hold control (HREQ, HACK) The hold state is the state when the external bus access stops and all pins go to a high-impedance state. However, the internal DRAM can be accessed while the external bus is in the hold state. _____ To put the M32000D4BFP-80 into the hold state, input an "L" level to HREQ. When the hold request is accepted and the M32000D4BFP-80 en_____ ters the hold state, an "L" level is output from HACK.
19
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
__
* Internal DRAM access control (CS) __ The internal DRAM can be accessed when CS is driven to an "L" ____ level after the M32000D4BFP-80 enters the hold state (HACK = "L"). To access the internal DRAM from external, the following signals from the system bus side should be controlled. * A8 to A30 Input internal DRAM addresses to be read or written. ___ ___ * BCH, BCL Specify ___byte position of data to be written into the internal the ___ DRAM. BCH corresponds to the MSB side (D0 to D7), and BCL corresponds to the LSB side (D8 to D15). __ * R/W ___ Specify read or write operation. When reading, R/W = "H". When __ writing, R/W = "L". * D0 to D15 16-bit data I/O bus. _____ * DC This signal notifies to an external bus master that the internal DRAM access is_____ complete. When access is complete, an "L" level is output to DC.
Read and write operations of the M32000D4BFP-80 are carried _____ out ___ _______ _______ using the address bus, data bus, and the R/W, BCH, BCL and DC ___ signals. When reading, the R/W signal goes to an "H" level, and the _______ _______ BCH and BCL signals go to an "L" level. The CPU reads the data in the valid_______ positions. When writing, an "L" level is output from R/ byte ___ _______ W, and BCH and BCL are output according to the valid byte positions, so as to specify the byte positions for writing into an external device.
idle
read
read
idle
CLKIN
BS A8 - A30 SID, ST R/W "H"
BCH, BCL BURST "H" "Hi-Z" "Hi-Z"
Table 1 Pin condition in hold state
D0 - D15
pin name
____
pin condition or operation high-impedance
DC
A8 - A30, SID, ____ BCH, BCL __ ___ ______ ST, R/W, BS, BURST D0 - D15
__
DC
_____
HACK other pins
output when internal DRAM__ read is by__ external bus master (CS = "L", an R/W = "H"), otherwise high-impedance output when internal DRAM is accessed by an external bus master __ (CS = "L"), otherwise high-impedance output "L" normal operation
idle
write
write
idle
CLKIN
BS A8 - A30 SID, ST R/W
BCH, BCL "H" "Hi-Z" "Hi-Z"
BURST D0 - D15
DC
Note: "Hi-Z" means high-impedance, and
indicates sampling timing.
Fig. 16 Read/write timing (two no-wait accesses)
20
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
__
When an "L" level is input to DC, the next bus cycle is processed and wait cycles are inserted until this point. When a write cycle comes immediately after a read cycle, the M32000D4BFP-80 inserts an idle cycle to prevent a collision with data on the system bus. The same applies to write cycles (burst write access) immediately after a burst read cycle.
idle
read
idle
write
idle
CLKIN
BS A8 - A30
idle read read idle
SID, ST R/W
CLKIN
BCH, BCL
BS A8 - A30 SID, ST R/W "H"
BURST
"H" "Hi-Z" "Hi-Z" "Hi-Z"
D0 - D15
BCH, BCL BURST
DC
"H" "Hi-Z" "Hi-Z" "Hi-Z"
Note: "Hi-Z" means high-impedance, and
indicates sampling timing.
D0 - D15
DC
idle
write
write
idle
Fig. 18 Automatic idle cycle insertion between consecutive read and write cycles
CLKIN
BS A8 - A30 SID, ST R/W
BCH, BCL BURST
"H" "Hi-Z" "Hi-Z"
D0 - D15
DC
Note: "Hi-Z" means high-impedance, and
indicates sampling timing.
Keep DC signal at the "H" level when waits are inserted.
Fig. 17 Read/write timing (two one-wait accesses)
21
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
______
The M32000D4BFP-80 outputs the BURST signal and carries out a burst transfer when reading "the word-size data aligned on the 32-bit boundary" or "a maximum 4 words of instructions aligned on the 128______ bit boundary". The BURST signal is synchronized with the CLKIN falling edge of the first bus access cycle and output "L" level. It returns to an "H" level synchronized with the first CLKIN falling edge of the last bus access cycle. Addresses A8 to A30 are output for each cycle. When burst reading 32-bit data, the MSB-side 16-bit read bus cycle is carried out first followed by the LSB-side 16-bit read bus cycle. When the cache memory operation mode is the instruction cache mode, and burst reading of the instructions within the 128-bit boundary for cache replacement occurs, the bus cycle is driven a fixed 8 times from an arbitrary 32-bit boundary address and to wraparound within the 128-bit boundary. When other than the instruction cache mode is selected and burst reading a set of instructions of less than 128 bits, consecutive bus cycles are driven from an arbitrary 32-bit boundary address as the top to the 128-bit line (A28 to A30 = "111").
idle
burst read (1 word)
idle
CLKIN
BS A8 - A30 SID, ST R/W "H"
BCH, BCL BURST D0 - D15 "Hi-Z" "Hi-Z"
DC
Note: "Hi-Z" means high-impedance, and indicates sampling timing. Wait cycles can be inserted even when burst transferring by setting DC = "H".
Fig. 19 1-word (32-bit) burst read timing (1-0 wait)
idle
burst read ( 4 words)
idle
CLKIN
BS A8 - A30 SID, ST R/W "H"
BCH, BCL
BURST D0 - D15 "Hi-Z"
DC
Note: "Hi-Z" means high-impedance, and indicates sampling timing. Wait cycles can be inserted even when burst transferring by setting DC = "H".
Fig. 20 4-word (128-bit) burst read timing (1-0-0-0-0-0-0-0 wait)
22
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
_____
When writing word-size data aligned on the 32-bit boundary, the M32000D4BFP-80 carries out a burst-transfer by outputting the ______ BURST signal. When burst-writing 32-bit data, the MSB-side 16-bit write bus cycle______ first, followed by the LSB-side 16-bit write is driven bus cycle. The BURST signal is synchronized with the CLKIN falling edge of the first bus access cycle, and "L" level is output. It returns to "H" level in synchronization with the CLKIN falling edge of the last bus access cycle. Addresses A8 to A30 are output for each cycle.
When an "L" level is input to HREQ, the M32000D4BFP-80 switches _____ to the hold state and outputs an "L" level to HACK. While the M32000D4BFP-80 is in the hold state, bus related pins go to a high impedance state, and data transfer is carried out on the system bus. _____ To return to normal operation mode from the hold state, the HREQ signal should be changed to an "H" level.
(see note 1)
(see note 1)
write
idle
hold shift
hold
return
idle
idle
burst write (1 word)
idle
CLKIN
CLKIN
HREQ
(see note 2)
BS A8 - A30 SID,ST R/W
HACK BS A8 - A30 SID, ST R/W
(see note 2)
"Hi-Z"
"Hi-Z"
"Hi-Z"
BCH, BCL
BCH, BCL
"Hi-Z"
BURST D0 - D15 "Hi-Z" "Hi-Z"
BURST D0 - D15 "Hi-Z"
"Hi-Z"
(see note 3)
DC
"Hi-Z"
DC
Notes 1: Before switching to the hold state, an idle cycle of 1 CLKIN clock period is always inserted. After returning from the hold state, an idle cycle of 1 to 5 CLKIN clock periods is always inserted. 2: "Hi-Z" means high impedance, and indicates sampling timing. 3: While the M32000D4BFP-80 is in the hold state, the DC signal is driven and output when the CS signal is input.
Note: "Hi-Z" means high-impedance, and indicates sampling timing. Wait cycles can be inserted even when burst transferring by setting DC = "H".
Fig. 21 1-word (32-bit) burst write timing (1-0 wait) Fig. 22 Bus arbitration timing
23
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
When the M32000D4BFP-80 is in the hold state and an "L" level is __ input to CS, the M32000D4BFP-80 interprets it as a bus access re__ quest to the internal DRAM. In this case, when the R/W signal is an "H" level, the memory controller drives a read cycle to the internal DRAM. In the read cycle, the 16-bit data for the address ____ specified with A8 to A30, is output from D0 to D15 regardless of the BCH and ___ __ BCL settings. Also the DC signal is output. The M32000D4BFP-80 reads 128 bits of data from the block on the 128-bit boundary including the requested address into the 128-bit buffer of the bus interface unit. 3 to 7 CLKIN clock periods are necessary for the first bus access, however, when reading consecutive address within the 128-bit boundary, the subsequent read bus cycles are completed in 1 CLKIN clock period because a read from the internal DRAM does not take place. Once the external bus master read cycle has been driven, it cannot __ be aborted. When an "L" level is input to CS and an access has started, the values of this and other __ control signals should be held __ during the wait cycles (that is while __ = "H"). After DC outputs an DC "L" level (access complete), return CS to the "H" level between the CLKIN falling edge corresponding to the last read cycle and the fol______ lowing CLKIN falling edge. Return HREQ to the "H" level to return the M32000D4BFP-80 to the normal operation mode from the hold __ state either at the same time as or after CS is returned to the "H" level.
hold shift hold read CLKIN read read read
return
HREQ
HACK CS A8 - A30 "Hi-Z" "Hi-Z"
"Hi-Z" R/W "Hi-Z" BCH, BCL
"Hi-Z" "Hi-Z" "Hi-Z"
D0 - D15
"Hi-Z" "Hi-Z" "Hi-Z"
DC
("L" output) V Note: "Hi-Z" means high impedance, and indicates sampling timing. The value of the R/W signal that controls the data direction of the bus interface cannot be changed during CS="L". Hold this value while CS="L". Also, where marked above with V, 3 to 7 CLKIN clock periods are necessary for the first read operation (also when reading crosses an 128-bit boundary) when reading from the internal DRAM. Hold the input value of the address or other control signals during these wait cycle periods (DC = "H"). Consecutive read operations within an 128-bit boundary are completed in 1 CLKIN clock period. During these wait cycle period, CS cannot be returned to an "H" level (the access cannot be aborted). CS can only be returned to an "H" level after DC is driven to "L".
Fig. 23 Read bus cycle to internal DRAM
24
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
When the M32000D4BFP-80 is in the hold state and an "L" level is __ input to CS, the M32000D4BFP-80 interprets it as a bus access re__ quest to the internal DRAM. In this case, when the R/W signal is at an "L" level, the memory controller drives a write cycle to the internal ____ ___ DRAM. Byte data control is specified by the BCH and BCL signals. ____ Only data in the byte positions for which an "L" level is input to BCH ___ __ or BCL are written. When writing is complete, an "L" level DC signal is output. The M32000D4BFP-80 stores the requested data in the 128-bit data buffer of the BIU, before writing to the internal DRAM. This reduces the number of accesses to the internal DRAM when a request to writing to consecutive addresses is made, and improves bus cycle throughput. Consecutive write cycles within an 128-bit boundary are completed in 1 CLKIN clock period. 3 to 7 CLKIN clock periods are necessary for a write access crossing an 128-bit boundary when writing to the internal DRAM. Once the external bus master write cycle__ been driven, it cannot be aborted. When an "L" level has is input to CS and an access has started, the values of this and other __ control signals should be held during the wait cycles (that is while DC __ __ = "H"). After DC outputs an "L" level (access complete), return CS to the "H" level between the CLKIN falling edge corresponding to the ______ last write cycle and the following CLKIN falling edge. Return HREQ to the "H" level to return the M32000D4BFP-80 to the normal opera__ tion mode from the hold state either at the same time as or after CS is returned to the "H" level.
When the external bus master makes an access, the value of the __ R/W signal that controls the data direction of the bus interface can__ not be changed during CS="L". Therefore, read cycles and write cycles __ cannot be mixed while CS = "L". When starting a write cycle following after a__ cycle and starting a read cycle following a write cycle, read keep the CS signal at an "H" level for at least 1 CLKIN.
hold shift hold read CLKIN CS = "H" write return
HREQ
HACK CS "Hi-Z" "Hi-Z"
A8 - A30
"Hi-Z" R/W "Hi-Z" BCH, BCL "Hi-Z" D0 - D15 "Hi-Z" "Hi-Z" DC "Hi-Z"
"Hi-Z"
"Hi-Z"
"Hi-Z" "Hi-Z"
("L" output) V
hold shift hold write CLKIN write write write return
("L" output)
Note: "Hi-Z" means high-impedance, and indicates sampling timing. Also, where marked above with V, keep CS signal to "H" at least 1 CLKIN when starting a write bus cycle after a read bus cycle or a read bus cycle after a write bus cycle.
HREQ
HACK CS "Hi-Z" "Hi-Z" "Hi-Z" "Hi-Z"
Fig. 25 Read/write bus cycle to internal DRAM
A8 - A30
R/W
BCH, BCL D0 - D15 "Hi-Z"
"Hi-Z"
"Hi-Z"
"Hi-Z" "Hi-Z" "Hi-Z"
DC
("L" output) V
("L" output)
Note: "Hi-Z" means high impedance, and indicates sampling timing. The value of the R/W signal that controls the data direction of the bus interface cannot be changed during CS="L". Hold this value while CS="L". Also, where marked above with V, 3 to 7 CLKIN clock periods are necessary for writing operation to internal DRAM crossing an 128-bit boundary. Hold the input value of the address or other control signals during these wait cycle periods (DC = "H"). Consecutive writing operations within an 128-bit boundary are completed in 1 CLKIN clock period. During these wait cycle period, CS cannot be returned to "H" level (the access cannot be aborted). CS can only be returned to a "H" level after DC is driven to "L".
Fig. 24 Write bus cycle to internal DRAM
25
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
Master/slave mode
_
The M32000D4BFP-80 has an M/S (master/slave) pin for multiprocessor configuration use. _ * master mode (M/S = "H") _ This is normal operation mode. Set the M/S pin to an "H" level. It is used when the M32000D4BFP-80 is used as the main CPU in a system. _ * slave mode (M/S = "L") This operation mode is for when the M32000D4BFP-80 is used as a _ coprocessor. Set the M/S pin to an "L" level. When set to slave mode, the M32000D4BFP-80 does not start operation even after a reset, until an interrupt request or the SBI is input. Processing is carried out by communicating with the master M32000D4BFP-80, using the two programmable I/O ports and the external interrupt signal.
* Coprocessor only configuration example The slave M32000D4BFP-80 accesses only the internal DRAM and _ _____ never the external bus. M/S and HREQ are fixed at the "L" level. The slave M32000D4BFP-80 executes the instructions that the master M32000D4BFP-80 downloads to the internal DRAM. The data transfer request (processing complete) from the slave M32000D4BFP-80 is notified to the master M32000D4BFP-80 by inputting the interrupt request via the programmable I/O port. The data transaction is carried out when the master M32000D4BFP-80 accesses the internal DRAM in the slave M32000D4BFP-80. * Common bus coprocessor configuration example In this configuration, the slave M32000D4BFP-80 can also access the external bus. Communications between the master and slave CPUs is carried out using the programmable I/O ports and the interrupt request input.
lock control register (MLCR) < address: H'FFFF FFF7>
D24 D25 D26 D27 D28 D29 D30 D31 LM
M/S
M32000D4BFP-80 (master)
no access to external bus M/S
M32000D4BFP-80 (slave)
HREQ
D 24 - 30 31
bit name Not assigned. LM (lock mode)
function
R W 0 !
INT
INT
PP0
ROM
______
0: HREQ exclusive lock mode ___ 1: CS exclusive lock mode R = ... read enabled W = ! : write disabled
ASIC
R = 0 ... "0" when reading W = ... write enabled
Fig. 26 Lock control register
M/S HREQ HACK INT
M32000D4BFP-80 (master)
M/S
M32000D4BFP-80 (slave)
HREQ HACK
INT
PP0
ROM
ASIC
bus arbiter
Fig. 27 Master/slave system configuration example
26
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
Power management function
The M32000D4BFP-80 has the following two low-power consumption modes. * standby mode * CPU sleep mode
power management (MPMR) < address: H'FFFF FFFB>
D24 D25 D26 D27 D28 D29 D30 PM0 D31 PM1
D 24 - 29 30, 31
bit name Not assigned. PM0, PM1 (low power consumption mode)
function
R W ! 0
00: normal operation mode 01: (reserved) 10: CPU sleep mode 11: standby mode R = ... read enabled W = ! : write disabled
In standby mode, all clock supply stops and only the contents of the internal DRAM are retained. The power requirement is only that which the internal DRAM needs for refreshing itself. When set to standby mode, the M32000D4BFP-80 waits for the current bus operation to be completed. It then purges the cache memory and switches the internal DRAM to self-refresh mode. After that, the PLL and all clock _____ supplies stop and the STBY signal goes to an "L" level to indicate the _____ completion of the switch to standby mode. Input an "L" level to WKUP ___ or RST to return from standby mode to normal operation mode. The contents of the internal DRAM are retained upon return using the _____ WKUP signal. In CPU sleep mode, clock supply to the M32R CPU stops. In this mode, the internal DRAM, cache memory, memory controller and external bus interface continue to operate and the internal DRAM ___ ___ can be accessed from the external bus. Input an "L" level to INT, SBI ___ or RST to return to normal operation mode from CPU sleep mode. The contents of the cache memory, internal DRAM, general-purpose registers and programmable I/O control register are retained upon ___ ___ return using the INT or SBI signals.
R = 0 ... "0" when reading W = ... write enabled
Fig. 28 Power management control register
reset
normal operation mode set to standby mode (H'03 is written to MPMR register) set to CPU sleep mode (H'02 is written to MPMR register)
WKUP, RST input standby mode
INT, SBI, RST input CPU sleep mode
Fig. 29 State transition for low power consumption mode
27
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
Programmable I/O port
The M32000D4BFP-80 has two programmable I/O ports (PP0, PP1). Each port can be set as input or output.
Reset
____
programmable I/O port direction control register 0 (PPCR0) < address: H'FFFF FFE3>
D24 D25 D26 D27 D28 D29 D30 D31 PP0C
When an "L" level is input to RST, the M32000D4BFP-80 switches to the reset state. The reset state is released when an "H" level is input ____ to RST, and the program is executed from the EIT vector entry of the reset interrupt. All internal resources including the internal PLL (4x clock generator) are initialized. In order to stabilize PLL oscillation, ____ the "L" input to RST should last a minimum of 2 ms after the clock input to CLKIN stabilizes and VCC stabilizes to the specified voltage level. Table 2 Internal state after reset internal resources DRAM cache memory state undefined invalid (purged all) undefined
programmable I/O port direction control register 1 (PPCR1) < address: H'FFFF FFE7>
D24 D25 D26 D27 D28 D29 D30 D31 PP1C
general purpose registers (R0 - R15) control registers PSW (CR0) CBR (CR1) SPI (CR2) SPU (CR3) BPC (CR6) PC
B'0000 0000 0000 0000 ??00 000? 0000 0000
D 24 - 30 31
bit name Not assigned. PP0C, PP1C (port I/O direction)
function
R W ! 0 0: input port 1: output port
(BSM, BIE, and BC are undefined) H'0000 0000 undefined undefined undefined
master mode: execute from address H'7FFF FFF0 slave mode: wait for interrupt input at address H'7FFF FFF0 * execute from address H'0000 0010 ___ by inputting SBI signal * execute from address H'0000 0080 ___ by inputting INT signal
R = 0 ... "0" when reading W = ... write enabled
R = ... read enabled W = ! : write disabled
Fig. 30 Programmable I/O port direction control register
programmable I/O port data register 0 (PPDR0) < address: H'FFFF FFEB>
D24 D25 D26 D27 D28 D29 D30 D31 PP0D
I/O registers
ACC (accumulator) undefined PPCR0, PPCR1 H'00 (input) PPDR0, PPDR1 B'0000 000? (depends on input pin state) _____ MLCR H'00 (HREQ exclusive lock mode) MPMR H'00 (normal operation) MCCR H'01 (cache-off mode)
programmable I/O port data register 1 (PPDR1) < address: H'FFFF FFEF>
D24 D25 D26 D27 D28 D29 D30 D31 PP1D
D 24 - 30 31
bit name Not assigned. PP0D, PP1D (port data)
function R W ! 0 0: data = "0" 1: data = "1" R = ... read enabled W = ! : write disabled
R = 0 ... "0" when reading W = ... write enabled
Fig. 31 Programmable I/O port data register
28
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
Clock generating circuit
The M32000D4BFP-80 has a clock multiplier circuit and operates at four times the input frequency. The internal operation frequency becomes 80 MHz when a 20 MHz clock is input to CLKIN. A capacitor (C) should be connected to the PLLCAP pin, and the clock is input to the CLKIN pin. The PLLVCC and PLLVSS pins should be connected to the power source or the ground, respectively.
ADDRESSING MODE
M32R family supports the following addressing modes. < register direct > The general-purpose register or the control register to be processed is specified. < register indirect > The contents of the register specify the address in memory to be accessed. This mode can be used by all load/store instructions. < register relative indirect > (The contents of the register) + (16-bit immediate value which is signextended to 32 bits) specify the address in memory to be accessed. < register indirect and register update > * 4 is added to the register contents (the contents of the register before update specify the address in memory to be accessed) [LD instruction] * 4 is added to the register contents (the contents of the register after update specify the address in memory to be accessed) [ST instruction] * 4 is subtracted from the register contents (the contents of the register after update specify the address in memory to be accessed) [ST instruction] < immediate > The 4-, 5-, 8-, 16- or 24-bit immediate value. < PC relative > (The contents of PC) + (8, 16, or 24-bit displacement which is signextended to 32 bits and 2 bits left-shifted) specify the address in memory to be accessed.
M32000D4BFP-80
VCC 14 (PLLVCC) 18 (CLKIN)
clock input PLL clock generating circuit
16 (PLLCAP) 15 (PLLVSS)
C
recommended values in circuit
C: 1000 pF
Fig. 32 Oscillation circuit
29
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
INSTRUCTION FORMAT
There are two major instruction formats: two 16-bit instructions packed together within a word boundary, and a single 32-bit instruction.
INSTRUCTION SET
A total of 83 instructions are implemented. The load/store instructions carry out data transfers between a register and a memory. LD Load LDB Load byte LDUB Load unsigned byte LDH Load halfword LDUH Load unsigned halfword LOCK Load locked ST Store STB Store byte STH Store halfword UNLOCK Store unlocked The transfer instructions carry out data transfers between registers or a register and an immediate value. LD24 Load 24-bit immediate LDI Load immediate MV Move register MVFC Move from control register MVTC Move to control register SETH Set high-order 16-bit Compare, arithmetic/logic operation, multiply and divide, and shift are carried out between registers. * compare instructions CMP Compare CMPI Compare immediate CMPU Compare unsigned CMPUI Compare unsigned immediate * arithmetic operation instructions ADD Add ADD3 Add 3-operand ADDI Add immediate ADDV Add with overflow checking ADDV3 Add 3-operand with overflow checking ADDX Add with carry NEG Negate SUB Subtract SUBV Subtract with overflow checking SUBX Subtract with borrow
< 16-bit instruction > op1 R1 op2 R2 R1 = R1 op R2
op1
R1
c
R1 = R1 op c
op1
cond
c
Branch (Short Displacement)
< 32-bit instruction > op1 R1 op2 R2 c R1 = R2 op c
op1
R1
op2
R2
c
Compare and Branch
op1
R1
c
R1 = R1 op c
op1
cond
c
Branch
Fig. 33 Instruction format
30
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
* logic operation instructions AND AND AND3 AND 3-operand NOT Logical NOT OR OR OR3 OR 3-operand XOR Exclusive OR XOR3 Exclusive OR 3-operand * multiply/divide instructions DIV Divide DIVU Divide unsigned MUL Multiply REM Remainder REMU Remainder unsigned * shift instructions SLL Shift left logical SLL3 Shift left logical 3-operand SLLI Shift left logical immediate SRA Shift right arithmetic SRA3 Shift right arithmetic 3-operand SRAI Shift right arithmetic immediate SRL Shift right logical SRL3 Shift right logical 3-operand SRLI Shift right logical immediate The branch instructions are used to change the program flow. BC Branch on C-bit BEQ Branch on equal BEQZ Branch on equal zero BGEZ Branch on greater than or equal zero BGTZ Branch on greater than zero BL Branch and link BLEZ Branch on less than or equal zero BLTZ Branch on less than zero BNC Branch on not C-bit BNE Branch on not equal BNEZ Branch on not equal zero BRA Branch JL Jump and link JMP Jump NOP No operation

The EIT-related instructions carry out the EIT events (Exception, Interrupt and Trap). Trap initiation and return from EIT are EIT-related instructions. TRAP Trap RTE Return from EIT The DSP function instructions carry out multiplication of 32 bits ! 16 bits and 16 bits ! 16 bits or multiply and add operation; there are also instructions to round off data in the accumulator and carry out transfer of data between the accumulator and a general-purpose register. MACHI Multiply-accumulate high-order halfwords MACLO Multiply-accumulate low-order halfwords MACWHI Multiply-accumulate word and high-order halfword MACWLO Multiply-accumulate word and low-order halfword MULHI Multiply high-order halfwords MULLO Multiply low-order halfwords MULWHI Multiply word and high-order halfword MULWLO Multiply word and low-order halfword MVFACHI Move from accumulator high-order word MVFACLO Move from accumulator low-order word MVFACMI Move from accumulator middle-order word MVTACHI Move to accumulator high-order word MVTACLO Move to accumulator low-order word RAC Round accumulator RACH Round accumulator halfword
31
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
ABSOLUTE MAXIMUM RATINGS
Ratings Symbol VCC VI VO PD TOPR TSTG Power source voltage Input voltage Output voltage Power consumption Operating temperature Storage temperature TOPR = 25 C 0 -65 Parameter Conditions Min. -0.5 -0.5 -0.5 Max. 4.6 4.6 4.6 1000 70 150 Unit V V V mW C C
RECOMMENDED OPERATING CONDITIONS (VCC = 3.3 V 0.3 V, TOPR = 0 to 70 C unless otherwise noted)
Symbol VCC VIH VIL Power source voltage "H" input voltage "L" input voltage All inputs except following
____
Parameter
Ratings Min. 3.0 2.0 0.8VCC -0.3 -0.3 Typ. Max. 3.6 VCC+0.3 VCC+0.3 0.8 0.2VCC 2 2 50
Unit V V V V V mA mA pF
RST pin All inputs except following
____
RST pin IOH (see note) "H" output current IOL (see note) "L" output current CL output load capacity
Note: IOH and IOL represent the maximum values of DC current load. Intermittent current that is generated during output need not to be considered as long as the output load capacity is within the specified range.
32
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
DC CHARACTERISTICS ELECTRICAL CHARACTERISTICS (VCC = 3.3 V 0.3 V, TOPR = 0 to 70 C unless otherwise noted)
Symbol VOH VOL IOZ IIH IIL ICC Parameter "H" output voltage "L" output voltage Output current in off state "H" input current "L" input current Power source current Test conditions IOH = -2 mA IOL = 2 mA VO = 0 to VCC VIH = 0 to VCC +0.3 V VIH = 0 to VCC +0.3 V Average in normal operation mode VCC = 3.3 V (see note 1) Average in CPU sleep mode VCC = 3.3 V Average in standby mode VCC = 3.3 V (see note 2) All pins 165 120 -10.0 Ratings Min. 2.4 0.4 10.0 10.0 -10.0 260 205 2000 15 Typ. Max. Unit V V A A A mA mA A pF
C
Pin capacitance
Note 1:all pin outputs are in no-load condition. 2:TOPR = 25C
33
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
AC CHARACTERISTICS TIMING REQUIREMENTS (VCC = 3.3 0.3 V, CL = 50 pF, TOPR = 0 to 70 C unless otherwise noted)
(1) Input transition time
Symbol tr(INPUT) tf(INPUT) Parameter Input rise transition time Input fall transition time
____
Test conditions CMOS input RST pin CMOS input
____
Limits Min. Max. 5 2 5 2 Unit ns ms ns ms
Reference number 1 2
RST pin
(2) Clock, reset and wakeup timing
Symbol tc(CLKIN) tw(CLKINH) tw(CLKINL) tr(CLKIN) tf(CLKIN) tw(RST) tw(WKUP) Parameter Clock input cycle time External clock input "H" pulse width External clock input "L" pulse width External clock input rising time External clock input falling time Reset input "L" pulse width Wakeup input "L" pulse width 2 2 Test conditions Limits Min. 50 1/4CLKIN 1/4CLKIN 5 5 Max. 80 Unit ns ns ns ns ns ms ms Reference number 5 6 7 8 9 10 11
(3) Read and write timing
Symbol tsu(D-CLKIN) th(CLKIN-D) th(CLKIN-DCH) tsu(DCL-CLKIN) th(CLKIN-DCL) Parameter Data input set-up time before CLKIN Data input hold time after CLKIN
__ __
Test conditions Min. 5 2 5 2 5 2
Limits Max. Unit ns ns ns ns ns ns
Reference number 30 31 36 37 38 39
tsu(DCH-CLKIN) DC input "H" set-up time before CLKIN DC input "H" hold time after CLKIN
__
DC input "L" set-up time before CLKIN
__
DC input "L" hold time after CLKIN
34
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
(4) Arbitration and external bus master read/write timing
Symbol
_____ _____
Parameter
Test conditions
Limits Min. 5 2 5 2 5 2 5 2 Max. Unit ns ns ns ns ns ns ns ns
Reference number 40 41 48 49 50 51 52 53
tsu(HREQ-CLKIN) HREQ input set-up time before CLKIN th(CLKIN-HREQ) tsu(CS-CLKIN) th(CLKIN-CS) tsu(A-CLKIN) th(CLKIN-A) tsu(D-CLKINL) th(CLKINL-D) HREQ input hold time after CLKIN
__
CS input set-up time before CLKIN
__
CS input hold time after CLKIN Address input set-up time before CLKIN Address input hold time after CLKIN Data input set-up time before CLKIN Data input hold time after CLKIN
(5) Interrupt input timing
Symbol
___
Parameter INT input pulse width (see note)
___
Test conditions
Limits Min. tc(CLKIN) tc(CLKIN) Max. Unit ns ns
Reference number 63 64
tw(INT) tw(SBI)
___
SBI input pulse width (see note)
___
Note: Both INT and SBI are level-sense inputs. Keep them at an "L" level until the interrupt is accepted.
(6) I/O port timing
Symbol tw(PORTINL) tw(PORTINH) Parameter Port input "L" pulse width Port input "H" pulse width Test conditions Limits Min. 25 25 Max. Unit ns ns Reference number 69 70
35
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
SWITCHING CHARACTERISTICS (VCC = 3.3 0.3 V, CL = 50 pF, TOPR = 0 to 70 C unless otherwise noted)
(1) Output transition time
Symbol tr(OUTPUT) tf(OUTPUT) Parameter Output rising transition time Output falling transition time Test conditions Limits Min. Typ. Max. 8 8 Unit ns ns Reference number 3 4
(2) Read and write timing
Symbol
__
Test Parameter BS = "H" effective time after CLKIN
__
Limits Min. 0 8 tc(CLKIN)/4 tc(CLKIN)/4+8 10 0 10 0 10 0 10 0 10 0 0 8 0 8 0 15 0 16 Max. Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
conditions
Reference number 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 32 33 34 35
td(CLKIN-BSHX) td(CLKIN-BSL) td(CLKIN-BSLX) td(CLKIN-BSH) td(CLKIN-AV) td(CLKIN-AX) td(CLKIN-BCV) td(CLKIN-BCX) td(CLKIN-SIDV) td(CLKIN-SIDX) td(CLKIN-STV) td(CLKIN-STX) td(CLKIN-RWV) td(CLKIN-RWX)
BS = "L" delay time after CLKIN
__
BS = "L" effective time after CLKIN
__
BS = "H" delay time after CLKIN Address delay time after CLKIN Address effective time after CLKIN
____ ____ ___ ___
BCH, BCL delay time after CLKIN BCH, BCL effective time after CLKIN SID delay time after CLKIN SID effective time after CLKIN ST delay time after CLKIN ST effective time after CLKIN
__
R/W delay time after CLKIN
__
R/W effective time after CLKIN
______
td(CLKIN-BURSTHX) BURST = "H" effective time after CLKIN ______ td(CLKIN-BURSTL) BURST = "L" delay time after CLKIN
______
td(CLKIN-BURSTLX) td(CLKIN-BURSTH) td(CLKIN-DZX) td(CLKIN-DV) td(CLKIN-DVX) td(CLKIN-DXZ)
BURST = "L" effective time after CLKIN
______
BURST = "H" delay time after CLKIN Data output enable time after CLKIN Data output delay time after CLKIN Data output effective time after CLKIN Data output disable time after CLKIN
36
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
(3) Arbitration and external bus master read/write timing
Symbol
_____
Parameter HACK = "H" effective time after CLKIN
_____
Test conditions Min. 0 0
Limits Max. 8 8 16 0 0 15 16 0 0 0 12 12 0 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Reference number 42 43 44 45 46 47 54 55 56 57 58 59 60 61 62
td(CLKIN-HACKHX) td(CLKIN-HACKL) td(CLKIN-HACKLX) td(CLKIN-HACKH) td(CLKIN-AZ) td(CLKIN-AZX) td(CLKIN-DZX) td(CLKIN-DV) td(CLKIN-DXZ) td(CLKIN-DVX) td(CS-DCZX) td(CLKIN-DCHX) td(CLKIN-DCL) td(CLKIN-DCXZ) td(CLKIN-DCLX)
HACK = "L" delay time after CLKIN
_____
HACK = "L" effective time after CLKIN
_____
HACK = "H" delay time after CLKIN Address output disable time after CLKIN Address output enable time after CLKIN Data output enable time after CLKIN Data output delay time after CLKIN Data output disable time after CLKIN Data output effective time after CLKIN
__ __ __
DC output enable time after CS DC = "H" effective time after CLKIN
__
DC = "L" delay time after CLKIN
__
DC output disable time after CLKIN
__
DC = "L" effective time after CLKIN
(4) Standby timing
Symbol
_____
Parameter STBY = "H" effective time after CLKIN
_____
Test conditions
Limits Min. 0 tc(CLKIN)n/4+15 0 tc(CLKIN)n/4+15 Max. Unit ns ns ns ns
Reference number 65 66 67 68
td(CLKIN-STBYHX) td(CLKIN-STBYL) td(CLKIN-STBYLX) td(CLKIN-STBYH)
_____
STBY = "L" delay time after CLKIN (see note)
_____
STBY = "L" effective time after CLKIN
_____
STBY = "H" delay time after CLKIN (see note)
Note: The STBY signal is synchronized with the internal clock, therefore its timing changes at 0, 90, 180 and 270 (n=0, 1, 2, 3) degree phase of CLKIN.
(5) I/O port timing
Symbol tw(PORTOUTL) tw(PORTOUTH) Parameter Port output "L" pulse width (see note) Port output "H" pulse width (see note) Test conditions Limits Min. 10 10 Max. Unit ns ns Reference number 71 72
Note: The minimum pulse width value is that where the output is changed within 1 clock of the internal clock. Software processing time to write to the port data register is not included.
37
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
0.5VCC 1.0 k measured pin measured pin
CL = 50 pF
CL = 50 pF
CMOS output
CMOS output (during floating delay time measurement)
Fig. 34 Output switching characteristic measurement circuit
timing reference point (when not specified) CMOS input "H" input level "L" input level 0.9VCC 0.1VCC 0.8VCC 0.2VCC
schmitt trigger input
"H" input level "L" input level
VCC 0.0 V
0.9VCC 0.1VCC
CLKIN input
"H" input level "L" input level
VCC 0.0 V
Fig. 35 Input waveform and timing reference point during characteristic measurement
timing reference point CMOS output (when not specified) 0.8VCC 0.2VCC
"H" "Z"
"Z" "H"
CMOS output (during floating delay time measurement)
"L" "Z"
0.9VCC 0.1VCC
"Z" "L"
0.6VCC 0.4VCC
Fig. 36 Output timing measurement point during characteristic measurement
38
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
1 tr(INPUT)
2 tf(INPUT)
CMOS input
(except for schmitt trigger input and CLKIN input)
0.8VCC 0.2VCC
1 tr(INPUT) schmitt trigger input (RST)
2 tf(INPUT)
0.9VCC 0.1VCC
Fig. 37 Input transition time
3 tr(OUTPUT) 4 tf(OUTPUT)
output pin
0.8VCC 0.2VCC
Fig. 38 Output transition time
5 tc(CLKIN) 6 7
tw(CLKINH) tw(CLKINL) CLKIN (input)
0.5VCC
8 tr(CLKIN)
9 tf(CLKIN) 0.8VCC 0.2VCC
*1 10 tw(RST)
RST
(input)
*1 11 tw(WKUP)
WKUP
(input)
*1 The WKUP and RST signals can be input asynchronously. When returning from standby mode, the same timing applies.
Fig. 39 Clock reset and wakeup timing
39
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
0.5 VCC
0.5 VCC
CLKIN
(input)
12 td(CLKIN-BSHX) 13 td(CLKIN-BSL) 14 td(CLKIN-BSLX) *2 *2
15 td(CLKIN-BSH)
BS
(output)
16 td(CLKIN-AV) 17 td(CLKIN-AX)
A8 to A30 (output)
18 td(CLKIN-BCV) 19 td(CLKIN-BCX)
BCH, BCL(output)
20 td(CLKIN-SIDV) 22 td(CLKIN-STV) 21 td(CLKIN-SIDX) 23 td(CLKIN-STX)
SID, ST
(output)
24 td(CLKIN-RWV) 25 td(CLKIN-RWX)
R/W
(output)
*2 26 td(CLKIN-BURSTHX) 27 td(CLKIN-BURSTL) *2 *2 28 td(CLKIN-BURSTLX) 29 td(CLKIN-BURSTH)*2
BURST
(output)
30 tsu(D-CLKIN) 31 th(CLKIN-D)
D0 to D15(input)
32 td(CLKIN-DZX) 33 td(CLKIN-DV) 34 td(CLKIN-DVX) 35 td(CLKIN-DXZ)
D0 to D15(output)
*1 37 th(CLKIN-DCH) 38 tsu(DCL-CLKIN)
*1 36 tsu(DCH-CLKIN)
39 th(CLKIN-DCL)
DC
(input)
*1 The set up/hold of DC = "H" may vary depending on the wait cycle insertion. *2 All switching characteristics and timing requirements based on the falling edge of CLKIN are calculated according to the internal CLKIN (duty ratio is 50%) . When designing external peripheral circuits, the correction for the duty cycle of the actual CLKIN is necessary. [example] BS signal transition ("L" -> "H") when inputting 20MHz clock whose duty ratio is 45 - 55% ( 5%) to CLKIN: * minimum value of td(CLKIN-BSLX) = (value in table) - (correction value) = 12.5 - (50 x 5/100) = 10 [ns] * maximum value of td(CLKIN-BSH) = (value in table) + (correction value) = (50/4 + 8) + (50 x 5/100) = 23 [ns]
Fig. 40 Read/write timing
40
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
0.5VCC (input)
0.5VCC
CLKIN
*1 40 tsu(HREQ-CLKIN)
*1 41 th(CLKIN-HREQ)
HREQ
(input)
*2 42 td(CLKIN-HACKHX) *2 43 td(CLKIN-HACKL)
*2 44 td(CLKIN-HACKLX) *2 45 td(CLKIN-HACKH)
HACK
(output)
46 td(CLKIN-AZ) 47 td(CLKIN-AZX)
A8 to A30, SID, ST, BS, BCH, BCL, (output) R/W, BURST
*1 The HREQ signal can be input asynchronously.
*2 All switching characteristics and timing requirements based on the falling edge of CLKIN are calculated according to the internal CLKIN (duty ratio is 50%) . When designing external peripheral circuits, the correction for the duty cycle of the actual CLKIN is necessary. [example] HACK signal transition ("H" -> "L") when inputting 20 MHz clock whose duty ratio is 45 - 55% ( 5%) to CLKIN: * minimum value of td(CLKIN-HACKHX) = (value in table) - (correction value) = 0 - (50 x 5/100) = -2.5 [ns] * maximum value of td(CLKIN-HACKL) = (value in table) + (correction value) = 8 + (50 x 5/100) = 10.5 [ns]
Fig. 41 Bus arbitration timing
41
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
0.5 VCC
CLKIN (input)
40 tsu(HREQ-CLKIN)
*1
41 th(CLKIN-HREQ) *1
HREQ (input)
42 td(CLKIN-HACKHX) 43 td(CLKIN-HACKL) *1
*1
*1
44 td(CLKIN-HACKLX) 45 td(CLKIN-HACKH)
*1 HACK (output) *1
48 tsu(CS-CLKIN)
*1 49 th(CLKIN-CS)
48 49 48 49
CS (input)
50 tsu(A-CLKIN)
*1
51 th(CLKIN-A)
*1
50
51
R/W (input)
50 51 50 51
A8 to A30 BCH, BCL (input) *1 *1 52 tsu(D-CLKINL) 53 th(CLKINL-D)
D0 to D15 (input)
*1 54 td(CLKIN-DZX) 55 td(CLKIN-DV) *1
56 td(CLKIN-DXZ) *1 57 td(CLKIN-DVX)*1
D0 to D15 (output) *1
59 td(CLKIN-DCHX) *1 60 td(CLKIN-DCL) 58 td(CS-DCZX)
58 61 td(CLKIN-DCXZ)*1 62 td(CLKIN-DCLX)*1
59 60 61 62
*1 DC (output)
*1 All switching characteristics and timing requirements based on the falling edge of CLKIN are calculated according to the internal CLKIN (duty ratio is 50%) . When designing external peripheral circuits, the correction for the duty cycle of the actual CLKIN is necessary. [example] CS signal transition ("L" -> "H") when inputting 20 MHz clock whose duty ratio is 45 - 55% ( 5%) to CLKIN: * minimum value of tsu(CS-CLKIN) = (value in table) + (correction value) = 5 + (50 x 5/100) = 7.5 [ns] * minimum value of th(CLKIN-CS) = (value in table) + (correction value) = 2 + (50 x 5/100) = 4.5 [ns]
Fig. 42 External bus master read/write timing
42
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
63 tw(INT) *1
INT
(input)
64 tw(SBI) *1
SBI
(input)
*1 The INT and SBI signals can be input asynchronously. When returning from CPU sleep mode, the same timing applies. This timing value is "a value necessary for sampling the input to pins", however, not "a value that guarantees the interrupt acceptance". The interrupt request is a level-sensed input , and should be kept "L" until it is accepted.
Fig. 43 Interrupt input timing
CLKIN (input)
internal clock (80 MHz)
65 td(CLKIN-STBYHX) 66 td(CLKIN-STBYL) *1 *2 67 td(CLKIN-STBYLX) 68 td(CLKIN-STBYH) *1 *3
STBY
(output)
*1 The STBY signal is synchronized with the internal clock therefore, its timing changes at 0, 90, 180 and 270 degree phase of CLKIN. *2 The STBY goes to an "L" level when switched to the standby mode. *3 When returning from standby mode, the STBY signal goes to an "H" level 1 CLKIN after sampling that WKUP has returned from "L" to "H", or 3 CLKINs after sampling that RST = "L".
Fig. 44 Standby timing
[for input]
69 tw(PORTINL)
70 tw(PORTINH)
PX
[for output]
71 tw(PORTOUTL)
72 tw(PORTOUTH)
PX
Fig. 45 I/O port timing
43
MITSUBISHI MICROCOMPUTERS
M32000D4BFP-80
SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER
PACKAGE OUTLINE
Keep safety first in your circuit designs!
* Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
* * * These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party. Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts or circuit application examples contained in these materials. All information contained in these materials, including product data, diagrams and charts, represent information on products at the time of publication of these materials, and are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product listed herein. Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein.
*
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*
(c) 1998 MITSUBISHI ELECTRIC CORP. First edition, effective September. 1998 Specifications subject to change without notice.

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Price & Availability of M32000D4BFP-80

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